JPS634355B2 - - Google Patents
Info
- Publication number
- JPS634355B2 JPS634355B2 JP55054144A JP5414480A JPS634355B2 JP S634355 B2 JPS634355 B2 JP S634355B2 JP 55054144 A JP55054144 A JP 55054144A JP 5414480 A JP5414480 A JP 5414480A JP S634355 B2 JPS634355 B2 JP S634355B2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- lead
- semiconductor
- series
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414480A JPS56150843A (en) | 1980-04-25 | 1980-04-25 | Manufacture of lead frame and semiconductor using lead frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5414480A JPS56150843A (en) | 1980-04-25 | 1980-04-25 | Manufacture of lead frame and semiconductor using lead frame |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27650686A Division JPS62162346A (ja) | 1986-11-21 | 1986-11-21 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56150843A JPS56150843A (en) | 1981-11-21 |
| JPS634355B2 true JPS634355B2 (en]) | 1988-01-28 |
Family
ID=12962358
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5414480A Granted JPS56150843A (en) | 1980-04-25 | 1980-04-25 | Manufacture of lead frame and semiconductor using lead frame |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56150843A (en]) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57187945A (en) * | 1981-05-13 | 1982-11-18 | Nec Home Electronics Ltd | Manufacture of semiconductor device |
| JPS63296227A (ja) * | 1982-10-04 | 1988-12-02 | テキサス インスツルメンツ インコーポレイテツド | 半導体装置の製造方法とそれに用いる装置 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4528100Y1 (en]) * | 1967-09-27 | 1970-10-29 | ||
| JPS6029226B2 (ja) * | 1977-02-28 | 1985-07-09 | 日本電気株式会社 | 半導体装置用リ−ドフレ−ム |
| JPS5758777Y2 (en]) * | 1977-05-27 | 1982-12-15 | ||
| JPS6022822B2 (ja) * | 1979-06-13 | 1985-06-04 | 日本電気株式会社 | リ−ドフレ−ム |
-
1980
- 1980-04-25 JP JP5414480A patent/JPS56150843A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS56150843A (en) | 1981-11-21 |
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